Mfg Part Number: BA244 | NSN : 5961-01-117-8043 | NIIN : 011178043 | CAGE Code : 25403 | Manufacturer: Philips Circuit Assemblies | Item Name : Semiconductor Devic | FSC : 5961 Semiconductor Devices and Associated Hardware |
If you are interested in BA244 with NSN 5961-01-117-8043, we have you covered with available parts to purchase on Aviation Domain 360. Semiconductor Devic is listed alongside the part number BA244 under FSC 5961 Semiconductor Devices and Associated Hardware, having been manufactured by Philips Circuit Assemblies. If you would like to receive a quote on this item for your comparisons, please fill out and submit the RFQ form below with as much detail as you can provide. With the information that you offer, our team members will quickly craft you a personalized solution that takes your individual needs and requirements into account. As our team members are always available for customers 24/7x365, responses to RFQ submissions will be given in just 15 minutes or less.
Alongside CAGE Code 25403 parts from Philips Circuit Assemblies, we also provide items from countless leading global manufacturers that we trust as a part of our NO CHINA SOURCING pledge. Prior to shipment, numerous products are subjected to rigorous quality assurance measures, ensuring their reliability and caliber. Furthermore, all items ship alongside their qualifying certifications and manufacturing trace documentation as applicable. As a result of our practices, we are AS9120B, ISO 9001:2015, and FAA AC 00-56B certified and accredited. Get started with a competitive quote for NSN 5961-01-117-8043 and see why customers steadily depend on Aviation Domain 360 for all their operational needs.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-117-8043 Item Description: Semiconductor Devic | 5961 | 011178043 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Ba244 | C | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | GLASS |
ABHP | OVERALL LENGTH | 0.177 INCHES MAXIMUM |
ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
ADAV | OVERALL DIAMETER | 0.072 INCHES MAXIMUM |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-35 |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 20.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN |
CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
TTQY | TERMINAL TYPE AND QUANTITY | 2 INSULATED WIRE LEAD |
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