Request a Quote for Part 1600DMQB70 with the NSN 5962012579638 by Integrated Device Technology Inc
Microcircuit Memory
1600DMQB70 procurement notes
If you are interested in 1600DMQB70 with NSN 5962012579638, we have you covered with available parts to purchase on Aviation Domain 360. Microcircuit Memory is listed alongside the part number 1600DMQB70 under FSC , having been manufactured by Integrated Device Technology Inc. If you would like to receive a quote on this item for your comparisons, please fill out and submit the RFQ form below with as much detail as you can provide. With the information that you offer, our team members will quickly craft you a personalized solution that takes your individual needs and requirements into account. As our team members are always available for customers 24/7x365, responses to RFQ submissions will be given in just 15 minutes or less.
Alongside CAGE Code parts from Integrated Device Technology Inc, we also provide items from countless leading global manufacturers that we trust as a part of our NO CHINA SOURCING pledge. Prior to shipment, numerous products are subjected to rigorous quality assurance measures, ensuring their reliability and caliber. Furthermore, all items ship alongside their qualifying certifications and manufacturing trace documentation as applicable. As a result of our practices, we are AS9120B, ISO 9001:2015, and FAA AC 00-56B certified and accredited. Get started with a competitive quote for NSN 5962012579638 and see why customers steadily depend on Aviation Domain 360 for all their operational needs.
Reference data
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- AS9120:2025· Aerospace QMS
- ISO 9001:2015· Quality Management
- FAA AC 00-56B· Voluntary Industry Distributor Accreditation
- U.S. ONLY· Fulfillment
NSN Information for Part Number 1600DMQB70 with NSN 5962-01-257-9638, 5962012579638
Characteristics Data of NSN 5962-01-257-9638, 5962012579638
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.260 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 19 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -2.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 22 PRINTED CIRCUIT |