Request a Quote for Part 54HCT240M B2CJC with the NSN 5962012642984 by Freescale Semiconductor
Inclosure Configuration: Leadless flat pack Operating Temp Range: -55.0 to 125.0 deg celsius Features Provided: W/enable and high speed and low power and schottky and monolithic
54HCT240M B2CJC procurement notes
If you are interested in 54HCT240M B2CJC with NSN 5962012642984, we have you covered with available parts to purchase on Aviation Domain 360. Inclosure Configuration: Leadless flat pack Operating Temp Range: -55.0 to 125.0 deg celsius Features Provided: W/enable and high speed and low power and schottky and monolithic is listed alongside the part number 54HCT240M B2CJC under FSC , having been manufactured by Freescale Semiconductor. If you would like to receive a quote on this item for your comparisons, please fill out and submit the RFQ form below with as much detail as you can provide. With the information that you offer, our team members will quickly craft you a personalized solution that takes your individual needs and requirements into account. As our team members are always available for customers 24/7x365, responses to RFQ submissions will be given in just 15 minutes or less.
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- AS9120:2025· Aerospace QMS
- ISO 9001:2015· Quality Management
- FAA AC 00-56B· Voluntary Industry Distributor Accreditation
- U.S. ONLY· Fulfillment
NSN Information for Part Number 54HCT240M B2CJC with NSN 5962-01-264-2984, 5962012642984
Characteristics Data of NSN 5962-01-264-2984, 5962012642984
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | W/ENABLE AND HIGH SPEED AND LOW POWER AND SCHOTTKY AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 8 BUFFER, INVERTING |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 160.00 MICROAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 38.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 38.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |